India’s HCL Group and Taiwan’s Foxconn Group’s proposal to collectively construct a chip meeting unit within the nation is just not very passable, in accordance with the federal government, which has requested each firms to submit extra particulars in regards to the venture, mentioned folks in know of the developments.

The appliance is presently being thought of for incentives beneath the $10 billion Indian Semiconductor Mission, the folks informed ET.

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The extra particulars being sought embrace data on the expertise on which the outsourced meeting and testing (OSAT) unit will operate, the expertise companion for the enterprise and the kind of expertise switch settlement between the companions, mentioned the folks cited above.

“The 2 firms (HCL and Foxconn) might want to get a expertise companion. Now we have additionally sought particulars in regards to the uptake of the output from the OSAT unit they’ve proposed,” mentioned a senior official from the ministry of electronics and knowledge expertise.

This January, HCL and Foxconn introduced forming a JV to arrange an OSAT unit within the nation. On the time, folks within the know informed ET that the overall funding within the unit may very well be between $100 million and $150 million.

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Foxconn’s share within the three way partnership will likely be $37.2 million for 40% stake by means of Foxconn Hon Hai Expertise India Mega Improvement, a subsidiary of Hon Hai Applied sciences (Foxconn), the corporate knowledgeable inventory exchanges on the time.

HCL-Foxconn’s delay in securing approvals comes at the same time as Prime Minister Narendra Modi final week laid the muse stone for 3 semiconductor factories, one industrial chip fabrication unit and two meeting, testing, marking, and packaging (ATMP).

Whereas the chip fabrication unit is being constructed at Dholera in Gujarat by the Tata group and Taiwan’s PSMC, the 2 ATMP models are being constructed at Sanand in Gujarat and Morigaon in Assam, by the Tata group and CG Energy, respectively. The three models got approval on February 29.

An e-mail despatched to Foxconn didn’t yield any response. A spokesperson from HCL mentioned the corporate will be capable of share particulars of the venture “at an applicable time”.

The IT ministry’s queries to the HCL-Foxconn proposal marks a repeat of an earlier plan submitted by Foxconn, through which it had proposed to construct a chip manufacturing facility with Vedanta.

The sooner three way partnership, which was dissolved mutually final 12 months by the 2 companions, had additionally acquired caught resulting from lack of readability over getting a expertise companion since neither had expertise in chip manufacturing.

“They (the three way partnership) will want a robust technical companion. Now we have authorised three up to now and all of the purposes had all the small print such because the type of settlement between companions, and particulars of the consumption of chips produced at these factories. HCL and Foxconn may also want to inform us these,” mentioned one of many officers cited above.

In whole, India has 4 semiconductor chip manufacturing models beneath development. The full capability of the three OSAT and ATMP models is prone to be 80.5 million chips monthly, folks mentioned.

In December 2021, India made the primary effort in direction of organising a semiconductor manufacturing ecosystem within the nation, when it authorised a Rs 76,000 crore incentive plan for candidates.

Although the plan initially had a layered incentive construction for candidates primarily based on whether or not they utilized for chip manufacturing, OSAT or ATMP unit, it was later revised to present a flat 50% central subsidy to profitable candidates primarily based on the fulfilment of goals.

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