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Harman, a world chief in related car options, has introduced the launch of the Harman Prepared Join 5G Telematics Management Unit (TCU), leveraging new Snapdragon Digital Chassis related automotive applied sciences from Qualcomm Applied sciences, Inc. to push connectivity boundaries and democratise the automotive connectivity panorama.
Based mostly on the Snapdragon Auto 5G Modem, RF Gen 2, Harman, Prepared Join 5G TCU represents a big development in automotive connectivity, delivering wealthy in-cabin experiences for shoppers whereas decreasing time to market and engineering efforts for OEMs. Harman Prepared Join 5G TCU is at present accessible and will probably be showcased this week at Cellular World Congress (MWC) 2024.
As know-how leaders, the businesses stay dedicated to delivering options that not solely meet the calls for of immediately’s shoppers but in addition pave the way in which for the subsequent technology of related automobiles. With the Snapdragon® Modem-RF Gen 2 system, Harman Prepared Join 5G TCU gives unparalleled connectivity efficiency, whereas maximising upgradability, scalability, and value to fulfill the evolving necessities of immediately’s automotive market.
“Collectively, Harman and Qualcomm Applied sciences are working to redefine the way forward for automotive connectivity,” mentioned Pascal Peguret, SVP, Connectivity for Harman Automotive. “The Prepared Join 5G TCU product is a testomony to that shared imaginative and prescient, disrupting the standard TCU method as an off-the-shelf TCU product. Harman Prepared Join 5G TCU is designed to fulfill the wants of automakers merely and successfully whereas expediting the time to market and considerably decreasing growth price.”
“As pioneers in wi-fi applied sciences, Qualcomm Applied sciences is happy to additional strengthen our longstanding relationship with Harman to assist deliver the Prepared Join 5G TCU to the business. This product exemplifies our dedication to driving connectivity innovation within the automotive business, delivering a seamless mixture of efficiency, reliability, and cutting-edge options by way of the utilisation of our Snapdragon Modem-RF Gen 2 system,” mentioned Jeff Arnold, Vice President, Product Administration, Qualcomm Applied sciences, Inc.
Harman invitations the automotive business to discover the advantages of this know-how collaboration and expertise firsthand how the Harman Prepared Join 5G TCU is about to form the way forward for in-cabin connectivity. Please go to the Harman showcase at MWC in Corridor 4, Sales space# 4B45 to see an indication of the Prepared Join 5G TCU product all through the week, the corporate mentioned in a media launch.
