It said the OSAT (Outsourced Semiconductor Assembly and Testing) and ATMP (Assembly Testing Marking and Packing) unit will provide complete turn-key solutions (package design, bumping, assembly, testing, dropship) and will aim to commence operations in 2025.
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“ASIP plays a key role in semiconductor manufacturing as we help in assembling and testing of semiconductor chips that are fabricated at leading foundries around the world,” Venkata Simhadri, CEO of ASIP said in a statement. “Our upcoming hi-tech facility in Hyderabad aligns with our vision to give an impetus to the development of the Electronics System Design and Manufacturing (ESDM) value chain and provide OSAT/ ATMP support locally.”
The company said the global OSAT market size is estimated at $51.71 billion in 2023, and is expected to reach $76.23 billion by 2028, growing at a CAGR of 8.07% during this forecast period.
“India is an emerging market with a large world-class design talent pool and Government policies to support domestic manufacturing are extremely attractive. We are looking forward to playing a key role in India’s semiconductor manufacturing growth” Seong-Dong, CEO of APACT said.
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ASIP and IIT Hyderabad also signed an MoU in the presence of Dr VK Saraswat, Member NITI Aayog and Former Director General, DRDO & Chancellor JNU for R&D to develop next generation packages, develop and qualify new packaging materials and develop a skilled work-force for the OSAT industry.
